发明名称 Method of making a shielded semiconductor device
摘要 A semiconductor device operable in the microwave frequency range and including a shielding means isolating one integrated circuit (or group of integrated circuits) on the substrate from others. The shielding means is formed by integrated circuit manufacturing techniques, and avoids the necessity for assembling separate integrated circuit chips on a metallic shielding member. An insulator film is formed on the substrate overlying the integrated circuits. Conductive shielding means are embedded in the insulating film to define a line separating the integrated circuits to be shielded. The shielding means has a spacing density and height above the substrate adapted to block electromagnetic radiation between the integrated circuits. An effective ground is applied to the shielding means so that it performs its isolation function.
申请公布号 US5256590(A) 申请公布日期 1993.10.26
申请号 US19920870951 申请日期 1992.04.20
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 INOUE, AKIRA
分类号 H01L23/552;H01L23/66;(IPC1-7):H01L21/76 主分类号 H01L23/552
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