发明名称 |
Thick film hybrid circuit board device and method of manufacturing the same |
摘要 |
A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at cross portion where peripheral edge portion of the first layer and a peripheral edge portion of the second layer are crossed. The recessed portion is formed in the shape of being recessed inwardly of the second layer. Bleedings generated from the second layer consisting of paste are held in the recessed portion, so that short circuit accidents caused by the bleedings mutually combined are effectively prevented.
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申请公布号 |
US5256836(A) |
申请公布日期 |
1993.10.26 |
申请号 |
US19910764062 |
申请日期 |
1991.09.24 |
申请人 |
TOSHIBA LIGHTING & TECHNOLOGY CORPORATION |
发明人 |
EZAKI, SHIRO |
分类号 |
H01L27/01;(IPC1-7):H05K1/00 |
主分类号 |
H01L27/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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