| 摘要 |
PURPOSE:To provide a ceramic wiring board in which the resistance of leads is reduced. CONSTITUTION:A mounting section for mounting an electronic element is formed at the central part 1 of a ceramic substrate 6. A plurality of leads 2 connected to the electronic element mounted on the mounting section are extended from the outer peripheral side to the inner peripheral side of the substrate 6. The leads 2 are stuck to the substrate 6 with an active metallic brazing material 7 containing Cu, Sn, and an Ag-Cu-Ti alloy as metallic materials. |
