| 摘要 |
PURPOSE:To obtain a circuit board in which disorder of a signal waveform is eliminated and which is adapted for processing a high speed signal by filling resin soluble in alkaline solution at a position to be formed with a metal layer for connecting a ground layer to a coaxial wire shielding layer and a position to be formed with a continuity hole for connecting a circuit to a core wire on the way of the manufacturing step. CONSTITUTION:Holes are formed at a position 14 to be formed with a connecting metal layer 6 for connecting a ground layer 1 of a board to a coaxial wire shielding layer 5 and positions 14, 14' to be formed with continuity holes 8 for connecting a circuit to a core wire 7. Resin 13 removable with alkaline solution is filled in the provided holes. A plurality of coaxial wires are fixed in a desired shape on the surface of the board. Then, the resin 13 removable with the solution is dissolved in the solution to be removed. Further, the position 14 provided with the layer 6, the layer 5 of the coaxial wire and metal layer 6' except necessary position are removed by etching, and insulating resin is filled at the positions 14, 14'. |
