| 摘要 |
<p>PURPOSE:To electrically interconnect with high reliability a semiconductor package and a partner substrate for mounting the semiconductor package. CONSTITUTION:A lead structure 3 being an external connection lead is mounted in a through-hole 10 formed through a semiconductor package substrate 1. Each lead structure 3 includes a cylindrical casing 30, a connection terminal member 31 fited to an external opening end of the cylindrical casing 31, and a coiled spring 32 for energizing the connection terminal member 31 outwardly. An inward flange 30a is formed in the external opening end in the cylindrical casing 30 for preventing the connection terminal member 31 from being protruded. The cylindrical casing 30 of the lead structure 3 and the connection terminal member 31 both comprise metal, and each lead structure 3 is electrically connected with a predetermined terminal of an IC chip through a wire lead 5 fixed to an inside closed end of the cylindrical casing 30.</p> |
