| 摘要 |
PURPOSE:To repair a semiconductor device easily by including a process wherein the semiconductor device is provisionally secured. CONSTITUTION:On one face of a semiconductor device 11 where an input/output electrode 12 is installed, a photosetting adhesive 17 is so dropped that it may not be extended in all the space between the semiconductor device 11 and a glass substrate 18. Fine grains 14 provided in the input/output electrode 12 and a wiring electrode 19 on the glass substrate 18 are pressure-welded and then ultraviolet rays are cast to harden the photosetting adhesive 17 for provisionally securing the semiconductor device 11 onto the glass substrate 18. Then, an electric test is conducted. When the semiconductor device 11 proves bad, it is not necessary to consider an influence given to the glass substrate 18 by an adjacent liquid crystal cell 20 or the removal of a residual of the adhesive. So, a repairing work can be done easily. When the semiconductor device 11 is good, the space between the normal semiconductor device 11 and the glass substrate 18 is completely filled with the photosetting adhesive 17 to complete the connection of the semiconductor device 11. |
