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发明名称
METHOD OF FORMING A MULTILAYER WIRING STRUCTURE ON A SEMICONDUCTOR DEVICE
摘要
申请公布号
EP0517551(A3)
申请公布日期
1993.10.13
申请号
EP19920305240
申请日期
1992.06.08
申请人
NEC CORPORATION
发明人
INABA, TAKASHI
分类号
H01L21/302;H01L21/3065;H01L21/3213;H01L21/768;H01L23/532;(IPC1-7):H01L21/321;H01L21/90
主分类号
H01L21/302
代理机构
代理人
主权项
地址
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