| 摘要 |
<p>PURPOSE:To reduce the lead inductance and effectively dissipate the heat generated by an electronic circuit element to the outside, by making up the ground line, power supply line and signal line of a discrete wiring board, respectively. CONSTITUTION:The main part consists of a lead frame 1 for mounting a semiconductor device, a first wiring board 3 and a second wiring board 4. The first wiring board 3 has an insulating base 8 of a ceramic, a power supply line, a ground line, a part 11 on which a semiconductor device is to be mounted, and an external electrode. The second wiring board 4 has an insulating film 13 of an organic material, a signal line 14 and an external electrode 15. The lead frame for mounting a semiconductor device is connected with the first wiring board 3, and the second wiring board 4 is connected with the other side of a metallic island 5. With this, the total area of the respective boards can be increased to reduce the inductance and provide effective heat dissipation, thereby preventing thermal destruction of the electronic circuit element.</p> |
