| 摘要 |
PURPOSE:To produce a multilayer printed wiring board with no through hole. CONSTITUTION:After a photosensitive insulating resin layer 10 is applied to a laminated plate 103 on which a via-hole 41 and a circuit pattern are formed, a photo-via-hole is formed by photolithography. Then, the plate is subjected to plating and etching, so that a multilayer plate 105 is produced. A multilayer plate 104 produced by similar methods and the multilayer plate 105 are subjected to thermocompression bonding by way of a conductive paste 13 and a connection layer 52, whereby a multilayer printed wiring board is obtained. |
