发明名称 |
A METHOD FOR PREPARING A PRINTED WIRING BOARD FOR INSTALLATION IN AN IC CARD |
摘要 |
The wiring board (10) has a conductor circuit (13) on the surface and contains an IC module (12) mounted with an IC chip (11). Both surfaces of the board are covered with over sheets (32). Bumpers (20) are formed on portions of the conductor circuit (13), which serve as external contact terminals. The bumpers are made of any conductive material, such as copper or nickel, and the surfaces are to be coated with hard conductive alloys. The thickness should be 0.1-0.3mm so that the contact surface can be of the same level as the over sheets. External contact terminals are thus resistant to outer mechanical forces. |
申请公布号 |
EP0231384(B1) |
申请公布日期 |
1993.10.06 |
申请号 |
EP19860904376 |
申请日期 |
1986.07.14 |
申请人 |
IBIDEN CO, LTD. |
发明人 |
NAKANISHI, CHIAKI;HIROI, ATSUSHI;YANAGAWA, YOJI |
分类号 |
B42D15/10;G06K19/077;H05K3/24;H05K3/28;H05K3/40 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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