| 摘要 |
PURPOSE:To prevent the generation of heat distortion due to temperature differences on the surface of a wafer by applying the heat treatment on the wafer being rotated on a boat. CONSTITUTION:A wafer 12 is supported by rotating supporting rods 21 which has grooves and placed in a cylinderical reaction container. Next thereto heat treatment is performed on the wafer 12 being rotated by the rotation of the rotating supporting rods 21. The part at which the wafer touches the supporting rods are not restricted but sequentially changed, and the circumference of the wafer touches uniformly the supporting rod in a boat. Heat treatment during rotating wafer makes the wafer free from temperature differences and heat distortions and eliminates camber and ship and assures uniform dispositon to reacting gas and uniformity of diffusion and anealing. To make wafer to rotate the rotating supporting rods 21 and a rotating shaft of a motor or the like, are connected by connecting belt. |
