发明名称 |
ARRANGEMENT FOR GENERATING A PLASMA BY MEANS OF CATHODE SPUTTERING AND MICROWAVE IRRADIATION |
摘要 |
Title: Arrangement for generating a plasma by means of cathode sputtering and microwave irradiation The invention relates to an arrangement for generating a plasma by means of cathode sputtering and microwave irradiation. Herein the dc and/or ac voltage (10) of a magnetron is connected to the cathode (9) and a microwave is irradiated into the region between the cathode (9) and a substrate (5). The irradiation of the microwave takes place in the region of the magnetic field (22, 23) of the magnetron wherein the magnetic field and the microwave are layed out so that an electron cyclotron resonance develops and the microwave is absorbed in the plasma. (Fig. 1).
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申请公布号 |
CA2092599(A1) |
申请公布日期 |
1993.09.29 |
申请号 |
CA19932092599 |
申请日期 |
1993.03.26 |
申请人 |
LEYBOLD AKTIENGESELLSCHAFT |
发明人 |
LATZ, RUDOLF;RITTER, JOCHEN;SCHERER, MICHAEL;GEGENWART, RAINER |
分类号 |
H05H1/46;H01J37/32;H01J37/34;(IPC1-7):C23C14/28;C23C14/35 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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