| 摘要 |
PURPOSE:To do stable work without recourse to skill and without damaging an inner-layer pattern by performing mold releasing treatment to the whole face in the range a little larger than the shape, as regards the inner-layer pattern and the reference pattern before the lamination and adhesion of a multilayer wiring board. CONSTITUTION:Before lamination and adhesion of a multilayer wiring board, mold releasing treatment is performed to the whole face in the range a little larger than the shape, as regards the inner-layer pattern 2 to be exposed partially and the reference pattern 6 to become the reference in positioning with a processing machine. And, after stacking and adhesion, only the reference pattern 6 is partially exposed. Next, a positioning guide hole 20 is processed according to the exposed reference pattern 6. Next, an end mill 9 is attached to the processor, and the laminate to be processed is fixed to a processing table, with the positioning guide hole 20 as the reference in positioning, and a groove 3 as wide as the diameter of the end mill is processed. Next, a prepreg or a copper foil standing alone, being isolated by the processed groove 3 and the mold releasing treatment face is removed from the inner-layer pattern 2. |
