| 摘要 |
A high-density electrical connector filtering arrangement includes a dielectric insert having a passage for an electrical contact, a second parallelly extending passage in which a chip capacitor is placed, and a ground plate extending transversely to the contact and through which the contact passes without electrical connection thereto. The live electrode of the chip capacitor is electrically connected to the contact via an integral tab extending from the contact in a direction transverse to a longitudinal direction of the contact, and parallel to the ground plate, the chip capacitor being biased against the tab and electrically connected to ground by a resilient finger or extension having a distal end displaced from the ground plate in a direction parallel to the contact axis and having a ground electrode engaging surface which extends transversely to the contact axis.
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