| 摘要 |
<p>PURPOSE:To improve quality in a semiconductor element and a manufacturing yield in a manufacturing step. CONSTITUTION:A protection film 25 is formed with an insulating material so that a semiconductor substrate 22 excluding an internal circuit such as a connection electrode 23, a grounding line exposed outwardly from a cut-off plane of the semiconductor substrate 22, or the like can be coated. One end of a connection conductor 30 is connected with another substrate. When the connection electrode 23 is connected with the other end of the connection conductor 30 by a bonding wire 29, it is prevented that the bonding wire 29 comes into contact with an exposed part such as the grounding line or the like.</p> |
