| 摘要 |
A laser diode is provided which includes a substrate, a laser diode chip bonded on the substrate through a sub-mount, and a monitor element formed on the sub-mount. A space between a rear cleavage face of the laser diode chip and the surface of the monitor element is connected by a solid state waveguide, and the surface of the solid state waveguide is covered by a light reflecting resin layer.
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