| 摘要 |
<p>PURPOSE:To alleviate the restriction on an array of pads and to improve the efficiency of designing a pattern of a semiconductor chip by vertically moving up or down a predetermined lead of a plurality of leads sealed in an LSI package thereby to cross it with the other leads. CONSTITUTION:A semiconductor chip 3 is sealed in an LSI package body 2, and a plurality of leads 4a-4c extends from its side. A lead 4b of them crosses the adjacent lead 4c in the package 2, reversing the arrangement order to that of the pads 6b, 6c. In this case, steps 8, 9 formed by bending the lead 4b downward are provided at the lead 4b, the two leads 4c, 4b are crossed at the step 8 in noncontact with one another, and heights of the leads 4c, 4b are equalized at positions except the step 8. Thus, the restriction on the array of pads 6 due to the array of the leads 4 is alleviated, the degree of freedom of designing the entire chip is improved, and the efficiency of designing the pattern is enhanced.</p> |
