| 摘要 |
<p>PURPOSE:To improve connecting reliability by providing a semiconductor mounting part on a printed circuit board, providing a conductor circuit for wire bonding a semiconductor chip to the board, and connecting the leads of a lead frame to the circuit by metal diffusion. CONSTITUTION:A semiconductor mounting part 2 is provided at a center and a conductor circuit 4 for wire bonding to a semiconductor chip 3 is provided so as to extend from the part 2 radially to an edge on the surface of a printed circuit board 1. In order to connect the leads 6 of a lead frame 5 to the circuit 4, ends of the leads 6 are superposed in close contact with a surface of an outer end of the circuit 4 and connected by metal diffusion. It is preferable that entire surfaces or surfaces to be connected of the circuit 4 and the leads 6 are plated with noble metal and metal is diffused between the noble metals. Thus, a problem of the case of a connection of solder or conductive adhesive is eliminated, and rigid connection is performed.</p> |
