| 摘要 |
<p>PURPOSE:To increase the execution number of PGA packaging on a printed board by packaging a plurality of chip resistors in a plurality of pads provided on the upper surface of a package. CONSTITUTION:A cap 14 and a plurality of pads 12 electrically connected to an LSI inside a package are arranged in the central part of a PGA package 11. Further, any elements 13 of a plurality of chip resistors or clamp diodes or light-emitting diodes are connected to this plurality of pads 12. Thereby, an area for packaging of the elements and wiring on the printed board is not required; therefore, it has an effect of increasing the execution number of the PGA packaging on the printed board.</p> |
