IC PACKAGE MOUNTING STRUCTURE,申请号JP19920072844-传众专利搜索

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发明名称	IC PACKAGE MOUNTING STRUCTURE
摘要
申请公布号	JPH05235209(A)	申请公布日期	1993.09.10
申请号	JP19920072844	申请日期	1992.02.24
申请人	NEC CORP	发明人	MAKINO TATSUSHI
分类号	H01L23/28;H01L23/50;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):H01L23/28	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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