| 摘要 |
<p>PURPOSE:To provide a method for manufacturing a package for containing a semiconductor chip in which plated metal layers can be simultaneously connected to surfaces of all outer lead terminals without branching a pattern for leading out a metallized wiring layer. CONSTITUTION:All metallized wiring layers 7 brazed with an outer lead terminal 8 provided on an insulating board l are commonly connected by a metal thin film 5a to become a thin film wiring layer 5, and then a plated metal layer 9 is connected to the outer surface of the terminal 8.</p> |
