首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPH0535638(Y2)
申请公布日期
1993.09.09
申请号
JP19860146374U
申请日期
1986.09.26
申请人
发明人
分类号
B41J3/44;G03G15/00;G03G21/00;H04N1/00;(IPC1-7):H04N1/00
主分类号
B41J3/44
代理机构
代理人
主权项
地址
您可能感兴趣的专利
GAS WIPING APPARATUS FOR MOLTEN ZINC PLATING
Manufacturing method of functional Momordica charantia beverage for lowering blood glucose
Multiple Linear Regression―Artificial Neural Network Hybrid Model Predicting Heat of Vaporization of Pure Organic Compound for ２９８Ｋ
SAFE BRAKE DEVICE OF BICYCLE
DIFFUSER CASE REMOVAL APPARATUS AND METHOD
STABILIZATION OF HYPOXIA INDUCIBLE FACTOR (HIF) ALPHA USING INHIBITORS OF HIF PROLYL HYDROXYLASE
PROCESSES FOR THE PREPARATION OF AZOXYSTROBIN USING DABCO AS A CATALYST AND NOVEL INTERMEDIATES USED IN THE PROCESSES
PLUMBING FIXTURE ENCLOSURE
A LAMBDOIDAL LADDER
METHOD OF MANUFACTURING AN ENGRAVED PLATE
NO-DRIP CHECK VALVES
EXTRUDED FLEXIBLE POLYMERIC SHEET MATERIAL AND PRODUCTS MADE THEREFROM
TREATMENT OF SLEEP-WAKE DISORDERS
POURING NOZZLE
CO-POLYMERIC DEVICES FOR CONTROLLED RELEASE OF ACTIVE AGENTS
APPARATUS FOR CLEANING SURFACE OF BUILDING AND CLEANING METHOD OF BUILDING
WIRELESS IDENTIFICATION OF FRIEND OR FOE SYSTEM USING MULTIBAND FREQUENCY
TEXTILE PRINTING MACHINE
MEASURING DEVICE AND METHOD
PCB(PRINTED CIRCUIT BOARD) FOR MOLDING BY EMC(EPOXY MOLDING COMPOUND) AND METHOD FOR MANUFACTURING PACKAGED PRODUCT USING THE PCB
