发明名称 |
Method of manufacturing a switch substrate |
摘要 |
A switch substrate for a switching device that includes an electrical contact brush, the substrate formed with alternating conductive and insulating portions on its surface and having a groove formed between the conductive and insulating portions to eliminate insulating abrasion powder from the surface of the contact brush. The top of the conducting portions is higher than the bottom of the groove but can be above or below the surface of the insulating portions. To form such a substrate, a conductive layer having projections is formed and is engaged with a mold so that the projections are compressed. After the substrate is removed from the mold, the compressed projections extend to their actual height.
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申请公布号 |
US5242642(A) |
申请公布日期 |
1993.09.07 |
申请号 |
US19910799654 |
申请日期 |
1991.11.29 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
IIJIMA, SHUNICHI;TAKEMURA, MASANORI |
分类号 |
H01H1/029;H01H11/00;H01H19/58;H05K3/40 |
主分类号 |
H01H1/029 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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