Chip on board assembly

摘要

A chip-on-board assembly and a method of making is described in which semiconductor chips (32) having center contacts (35) are mounted active side down on the circuit board (31) with the center contacts (35) centered in an elongated opening (33) in the circuit board (31). The center contacts (35) are connected through the openings (33) in the circuit board (31) to contacts (34) on the circuit board (31) on the opposite side of the circuit board (31) on which the semiconductor chip (32) is mounted. Semiconductor chips (32) are alternately mounted on opposite sides of the circuit board (31) to provide a higher placement density of semiconductor chips.