发明名称 |
MANUFACTURE OF PRINTED WIRING BOARD |
摘要 |
PURPOSE:To provide a printed wiring board wherein its mounting area is large and its cost is low by a method wherein a through hole which makes both faces of the wiring board conductive is formed in the same place as a land for mounting use. CONSTITUTION:A conductive ink 5 is buried in a through hole 4 which has been made in a double-sided copper-clad laminated board; it is hardened under a prescribed condition; after that, an electrolytic copper plating operation is executed to both faces of the double-sided copper-clad laminated board 1; copper-plated layers 6 are formed; after that, a circuit in which a land 7 for component mounting use is formed directly above the hardened conductive ink 5 is drawn on the copper-plated layer by using a dry film or an ink for circuit formation use; a circuit is formed by an etching operation or the like. |
申请公布号 |
JPH05218618(A) |
申请公布日期 |
1993.08.27 |
申请号 |
JP19920040177 |
申请日期 |
1992.01.30 |
申请人 |
CMK CORP |
发明人 |
OTANI YASUAKI;ORUKAWA FUSAO;TAKAI KENRO |
分类号 |
H05K3/06;H05K1/11;H05K3/24;H05K3/40;H05K3/46 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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