| 摘要 |
<p>PURPOSE: To provide a film-like resistor which is relatively high rated and is physically small-sized. CONSTITUTION: There are provided a chip 11 on which there is formed an electrically insulating and thermally conductive substrate, a resistive film 12 provided on one side of the chip, a lead 15 connected with the resistive film on the one side of the chip, and a molded structure body for protecting the chip, resistive film, and an inner lead of the lead to completely enclose them. The molded structure body 13 is formed with a highly thermally conducive epoxy resin, and has a bolt through-hole 16 for fixing a resistor to a base 19 or a heat sink.</p> |
