| 摘要 |
PURPOSE:To obtain a ceramic board in which its surface can be accurately flattened and finer wiring can be formed by laying substances having different elastic moduli on a center and a periphery of a clamping jig of the board and machining the board in a protruding or recess shape. CONSTITUTION:A ceramic thick film multilayer board 3 is formed with a circuit of metal conductors 1 in ceramics. At the time of machining, the board 3 is fixed by a clamping jig 13 by vacuum suction, wax fixing, etc. In the case of machining, a cup-shaped super-abrasive grindstone 12 is rotated, the board 3 is rotated while supplying machining solution 17 to be machined. In this case, a compression residual stress is generated on the surface of the board 3. When the board 3 is removed from the jig 13, it is opened to become a protruding shape. Then, elastic substances having different elastic moduli are laid on an outer periphery and a center of the jig 13, or piezoelectric elements 15 are contained in the jig 13. The conduction is controlled to form a protrusion or a recess, thereby obtaining an accuracy of zero warpage when the board 3 is removed from the jig 13. |
