| 摘要 |
PURPOSE:To prevent a resin from oozing out from the gaps between a plurality of leads when an IC chip provided with the plurality of the leads is resin-sealed. CONSTITUTION:When an IC chip 10 is resin-sealed including base parts 9a of a plurality of outer lead parts 9, each outer lead part 9 is held in by a parting surface 23 of a top force 21 and parting surface 24 of a bottom force 22 via an elastic sheet 30 using a molding die 20 consisting of the top and bottom forces 21 and 22 and are clamped. The sheet 30 is pressed, is subjected to elastic deformation and intrudes into the respective gaps between the outer lead parts 9. Thereby, a resin injected in cavities 25 and 26 does never ooze out from the gaps between the outer lead parts 9. |
