发明名称 SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION
摘要 <p>In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by names of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (22). By attachment of appropriate electric potentials (2), electrode molecules can be sputtered onto the electrode surfaces adjusting the resonant frequency characteristics of a crystal filter.</p>
申请公布号 WO1993016577(A1) 申请公布日期 1993.08.19
申请号 US1992010366 申请日期 1992.11.27
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