发明名称 SOLID-STATE IMAGE SENSING DEVICE
摘要 PURPOSE:To obtain a solid-state image sensing device wherein a package is lightweight as a whole by a method wherein a transparent lid whose cross-sectional shape is a U-shape is attached to a substrate. CONSTITUTION:A lid 3 which protects a solid-state image sensing element 1 from the outside is formed by integrally molding a polyolefin-based resin whose optical transmission factor is 90% or higher and whose optical characteristics such as a refractive index, birefringence and the like are excellent. A hollow whose cross section is a U-shape is formed in the lid in such a way that the lid does not come into contact with the solid-state image sensing element 1 and metal wires 4. The depth of the hollow is set at 0.6mm or higher; the width between a substrate 2 and a sealing part is set to a width of 1 mm or higher in order to make the creeping route of moisture or the like long. The substrate 2 and the lid 3 are bonded to an insulating resin 7 on the surface of the substrate by using an epoxy-based adhesive 6. Consequently, since an inorganic material such as a glass, a ceramic or the like is not used, the weight of a device can be made lightweight.
申请公布号 JPH05206427(A) 申请公布日期 1993.08.13
申请号 JP19920001967 申请日期 1992.01.09
申请人 NEC CORP 发明人 KATO CHIKAYUKI
分类号 H01L23/02;H01L27/14;H01L31/0203 主分类号 H01L23/02
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