| 摘要 |
PURPOSE:To improve heat radiating performance of a multichip module mounting a plurality of semiconductor chips, and to realize cost reduction for manufacturing the module. CONSTITUTION:A first electric wiring substrate 7 and semiconductor chips 2 which are mounted on the wiring substrate 7 are sealed with a resin 1. Heat sinks 4 are mounted directly on at least some of the semiconductor chips 2 by high heat conductive bonding agent 3. Therefore, the necessity of a cap is eliminated, and heat of the semiconductor chips are easily conducted to the first electric wiring substrate 7 through the heat sinks 4 or the resin 1, thereby heat radiating performance can be improved.
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