| 摘要 |
PURPOSE:To solve warpages and wavinesses of a disc substrate caused at the time of sticking out a synthetic resin disc substrate from the mold. CONSTITUTION:Disc sticking-out sleeves 101, 201 mounted on the central part of a stationary mold 1 and movable mold 2 are disposed at the location corresponding to the central hole of a disc. The disc parts corresponding to the sleeves 101,201 are post-finished into a predetermined inside diameter by a cutting process so as to be removed therefrom. Even inclination occurs in the sleeves 101,201, since the disc parts corresponding thereto are removed by a post-process, a disc substrate can be obtained which has good evenness without any warpages and wavinesses. |
