SEMICONDUCTOR MOUNTING DEVICE

摘要

PURPOSE:To prevent water invasion by blocking the water invasion from the resin surface and from the interface between the resin and a board by means of a metal cap and water repellent resin. CONSTITUTION:A semiconductor chip 9 is place on a semiconductor mounting recessed part 10 and a first resin frame 2 and a second resin frame 3 for sealing resin are provided. After the semiconductor chip 9 is coated with the sealing resin 5, a metal cap 11 is placed between the first resin frame 2 and the second resin frame 3 and water repellent resin 4 is injected in-between. The repellent resin can be injected between the first resin frame 2 and the second resin frame 3 and the metal cap can be mounted in the repellent resin. Thus, the semiconductor mounting device with connection reliability is provided.