| 摘要 |
<p>PURPOSE:To improve the properties of adhering a circuit substrate to a monolithic molded resin in developing an enclosure of a non-contact IC card using a monolithic molding process. CONSTITUTION:A frame 5 and a circuit substrate 2 are set in a die, then the interior of the frame is filled with resin using an injection molding process, and the substrate and functional parts are embedded in the resin to form an IC card. In this process, a thermal adhesive 7 is thermally transferred to the periphery of the substrate and the section where no parts are mounted, as a previous procedure, and the substrate and the monolithic molded resin are allowed to adhere together firmly by the heat and pressure generated when monolithic molding is achieved using an injection molding process. Consequently, adhesion occurs on the substrate 2 due to thermal transfer, so that this process can be applied to a large number of the substrates 2 without parts yet to be mounted. In addition, the adhesion is completed in the process of injection molding, so that no particular manufacturing procedures are required. Further, the adhesive can be handled easily during the process as it does not become viscous even at normal temperature.</p> |
