发明名称 Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof
摘要 A polyamic acid having a three-dimensional network molecular structure produced by a gel forming ring-opening polyaddition reaction in an organic solvent of the reaction components comprising: (A) an acid component consisting of at least one tetracarboxylic acid dianhydride selected from the group consisting of a tetracarboxy benzene dianhydride, a tetracarboxy dianhydride of a compound having 2 to 5 condensed benzene rings, and compounds represented by formula (III), and substituted compounds thereof: <IMAGE> (III) wherein R1 represents -O-, -CO-, -SO2-, -SO-, an alkylene group, an alkylene bicarbonyloxy group, an alkylene bioxycarbonyl group, a phenylene group, a phenylene alkylene group, or a phenylene dialkylene group, n4 is 0 or 1, n5 is 0 or 1; and n6 is 1 or 2, provided that the sum of n5 and n6 is 2, and (2) 0 to 10 wt % of at least one acid component selected from the group consisting of a di- or tricarboxylic acid, a carboxylic acid anhydride and a substituted compound thereof; (B) at least one aromatic diamine; and (C) at least one polyamino compound selected from the group consisting of compounds represented by formula (I) or (II): <IMAGE> (I) <IMAGE> (II) wherein A1 represents <IMAGE> A2 represents <IMAGE> <IMAGE> n1 is 0 or an integer from 1 to 4; n2 is 0 or an integer from 1 to 3; X represents an acid; q represents the base number of the acid; R represents -O-, -CH2-, -CO- or -SO2-; and n3 is 0 or 1; a polyimide derived from the polyamic acid; and a process for preparing a film of the polyamic acid or polyimide. The polyimide film has superior heat resistance and mechanical characteristics.
申请公布号 US5231162(A) 申请公布日期 1993.07.27
申请号 US19920840111 申请日期 1992.02.24
申请人 TOHO RAYON CO. LTD. 发明人 NAGATA, YASUHISA
分类号 C08G73/10 主分类号 C08G73/10
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