| 摘要 |
<p>PURPOSE:To increase the number of mounted parts per area of a given one substrate by incorporating a substrate with stacked electronic parts in a frame and adhering a panel covering the substrate to the surface of the frame. CONSTITUTION:Electronic parts 2 stacked in two stages are mounted on an electric circuit 1, and this electric circuit 1 is incorporated in a frame 3. In addition, the substrate 1 is covered by a panel 4 for protection, and the frame 3 is adhered to the panel 4 using an adhesive 5 to prepare an IC card. In this case, a lead 6 on the first electronic part 2 is stacked on a lead 6 on the second electronic part 2, and soldered together, and further these parts are mounted on the substrate 1. As the IC card thus obtained has the electronic parts stacked in two stages, the number of electronic parts mounted is doubled. It is possible to mount the electronic parts in three or more stages. Thus the number of electronic parts mounted increases and the performance of a finished product becomes better.</p> |
