| 摘要 |
A semiconductor card which at least comprises a printed circuit board, a volatile memory element mounted on the printed circuit board, a battery electrically connected with the printed board for serving to back up the volatile memory element, an input/output interface portion mounted on the printed board for communication with an external device, and a sealant or sealing layer made of a thermosetting resin in which the printed circuit board, volatile memory element and interface portion are integrally embedded, the semiconductor card further including a battery receiving portion formed of a thermoplastic resin having a space for receiving the battery therein, and a battery cover formed of a thermoplastic resin so as to serve to close an opening in the battery receiving portion, the battery receiving portion being fixed to the printed circuit board and integrally embedded in the sealing layer together with the other stated elements on the printed circuit board, and the battery receiving portion is joined after receiving the battery therein with a battery cover by means of welding.
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