Semiconductor component - comprises chip with bonding sites, base with hollow to house chip and lid on upper surface of chip

摘要

Semiconductor component (I) comprises: (a) a semiconductor chip (11) having edges, lying opposite each other, with a no. of bonding sites (11a); (b) a base (12) with a hollow (12a) housing the chip; (c) a lid (14) on the upper surface of the chip (11), the lid having solder bumps (15) in contact with the bonding sites (11a); and (d) a no. of metal contacts (16) applied on the bumps (15) of the lid. ADVANTAGE - The process avoids using a conductor frame and metal wires.