Tungsten metallization,申请号US19900517973-传众专利搜索

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发明名称	Tungsten metallization
摘要	The adhesion of tungsten to an underlying dielectric layer is improved by the use of a thin glue layer of either TiN or Al.
申请公布号	US5227335(A)	申请公布日期	1993.07.13
申请号	US19900517973	申请日期	1990.04.30
申请人	AT&T BELL LABORATORIES	发明人	HOLSCHWANDNER, LOWELL H.;RANA, VIRENDRA V. S.
分类号	H01L21/3205;H01L21/768	主分类号	H01L21/3205
代理机构		代理人
主权项
地址

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