发明名称 PRODUCTION OF HIGHLY INTEGRATED LEAD FRAME
摘要 PURPOSE:To stably manufacture a multi-pin lead frame which has a wide wire bonding effective width for an inner lead by both pressing and etching. CONSTITUTION:A lead frame is permitted to have at least an outer lead 4 and an inner lead 2 which is provided around a pad continuously from the outer lead. For the manufacturing of the lead frame, a photoresist film 9 is provided on a metal plate and a resist pattern is formed on the one plane of the photoresist film in the forming area of the inner lead 2 or the inner lead tip. Etching is performed from the one plane so as to etch the inner lead 2 or the tip of the inner lead and the outer lead 4 is formed by pressing.
申请公布号 JPH05175389(A) 申请公布日期 1993.07.13
申请号 JP19910361307 申请日期 1991.12.24
申请人 MITSUI HIGH TEC INC 发明人 KUBOTA SHIGEAKI;TSUJIMOTO KEIICHI
分类号 C23F1/00;H01L23/50 主分类号 C23F1/00
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