| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot plate which can heat a silicon wafer W1 uniformly. SOLUTION: A hot plate 3 is secured to the opening part 4 of a casing 2 through a thermal insulation seal ring 14 formed by adding fibers to resin. Since a planar basic material 9 is sustained in flattened state even if the thermal insulation seal ring 14 is softened thermally, a silicon wafer W1 can be heated uniformly.
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