发明名称 GUIDE RING AND CMP DEVICE
摘要 PROBLEM TO BE SOLVED: To protect a damascene wiring against erosion. SOLUTION: A W film is polished chemically and mechanically using a CMP device equipped with a guide ring 12, whose surface contains iron serving as a catalyst that accelerates the oxidation power of an oxidizing agent contained in slurry.
申请公布号 JP2002016024(A) 申请公布日期 2002.01.18
申请号 JP20000197235 申请日期 2000.06.29
申请人 TOSHIBA CORP 发明人 MINAMI FUKUGAKU;MATSUI YUKITERU;FUKUSHIMA MASARU
分类号 B24B37/00;B24B37/04;B24B37/30;B24B37/32;H01L21/304 主分类号 B24B37/00
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