| 摘要 |
PURPOSE:To provide a wire bonder employing a capillary which can contribute to high speed fabrication of semiconductor while preventing deformation of lead frame. CONSTITUTION:The wire bonder comprises a capillary 11 for passing a wire 5 to be connected between a bonding pad on a semiconductor chip 1 and a lead frame 3, wherein the capillary 11 is provided with a port 18 for blowing out high temperature gas directly toward a bonding position. |
