STRUCTURE FOR TEMPERATURE DETECTION IN INTEGRATED CIRCUIT PACKAGE,申请号EP19890115708-传众专利搜索

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发明名称	STRUCTURE FOR TEMPERATURE DETECTION IN INTEGRATED CIRCUIT PACKAGE
摘要
申请公布号	EP0359007(B1)	申请公布日期	1993.06.23
申请号	EP19890115708	申请日期	1989.08.25
申请人	NEC CORPORATION	发明人	UMEZAWA, KAZUHIKO
分类号	G01K1/16	主分类号	G01K1/16
代理机构		代理人
主权项
地址

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