摘要 |
PURPOSE:To easily remove electronic parts from such an adhesive carrier tape that the electronic parts are secured on the tape with an adhesive and, when the electronic parts are removed from the tape, the adhesive is also removed from the tape together with the parts. CONSTITUTION:An obstacle 6 is placed on the surface of a carrier tape on which electronic parts 5 are secured with an adhesive 5 and the parts 5 are removed from the carrier tape together with the adhesive when the parts come into collide with the obstacle 6. The removed parts 5 are taken out with the taking-out device 7 of a chip mounter. |