发明名称 METHOD FOR REMOVING ELECTRONIC PARTS FROM ADHESIVE CARRIER TAPE
摘要 PURPOSE:To easily remove electronic parts from such an adhesive carrier tape that the electronic parts are secured on the tape with an adhesive and, when the electronic parts are removed from the tape, the adhesive is also removed from the tape together with the parts. CONSTITUTION:An obstacle 6 is placed on the surface of a carrier tape on which electronic parts 5 are secured with an adhesive 5 and the parts 5 are removed from the carrier tape together with the adhesive when the parts come into collide with the obstacle 6. The removed parts 5 are taken out with the taking-out device 7 of a chip mounter.
申请公布号 JPH05152787(A) 申请公布日期 1993.06.18
申请号 JP19910334465 申请日期 1991.11.25
申请人 SENJU METAL IND CO LTD 发明人 ISHIKAWA MITSUO;TANIGUCHI SANAE;SATO ISAMU
分类号 B23P19/00;H05K13/02 主分类号 B23P19/00
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