发明名称 RESIN COMPOSITION, METHOD FOR FORMING TRANSPARENT FILM, AND TRANSPARENT FILM
摘要 PURPOSE:To prepare a resin comps. capable of forming a protective film excellent in adhesion and surface smoothness on the surface of a glass plate, etc., by compounding a specific epoxy resin, a curative contg. an o-cresol novolac resin, and a specific solvent. CONSTITUTION:An epoxy resin composition is prepared from an epoxy resin comprising 5-90wt.% polyepoxy resin of the formula and 95-10wt.% glycidyl ether of a novolac resin, a curative contg. an o-cresol novolac resin softening at 100-140 deg.C, and an org. solvent mixture comprising 10-90wt.% org. solvent boiling at 180-200 deg.C (e.g. butyl cellosolve acetate or diethylene glycol monomethyl ether) and 90-10wt.% org. solvent boiling at 140-170 deg.C (e.g. ethyl cellosolve acetate).
申请公布号 JPH05140267(A) 申请公布日期 1993.06.08
申请号 JP19910309328 申请日期 1991.11.25
申请人 NIPPON KAYAKU CO LTD;HITACHI LTD;HITACHI DEVICE ENG CO LTD 发明人 NAKAYAMA KOJI;FUTAMURA NOBUYUKI;MATSUYAMA SHIGERU;ISHII AKIRA
分类号 C08G59/06;C08G59/00;C08G59/20;C08G59/62;C08J5/18;C08L63/00;C09D163/00 主分类号 C08G59/06
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