发明名称 Laser rounding a sharp semiconductor projection
摘要 A method of rounding a sharp semiconductor projection jutting out from a principal body of semiconductor material comprises the step of irradiating the projection with a laser pulse having an energy density of less than about 1.5 joules/cm2.
申请公布号 US4249960(A) 申请公布日期 1981.02.10
申请号 US19790049597 申请日期 1979.06.18
申请人 RCA CORP 发明人 SCHNABLE, GEORGE L;WU, CHUNG P
分类号 H01L21/268;H01L21/86;(IPC1-7):H01L21/26;H01L21/26 主分类号 H01L21/268
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