| 摘要 |
<p>PURPOSE:To fix wafers under the condition of different sizes without changing a stage, increase the pressure of gas during wafer cleaning time and reduce the flow rate of cooling gas to be used by forming the shape of a wafer loading stage in such a fashion that it may be dented toward the center of the stage. CONSTITUTION:A wafer 8 is mounted on a stage 7 which is dent-shaped toward the central part of a semiconductor manufacturing device. The wafer 8 is vertically clamped by the stage 7 and a ring 9. When clamped, only the outer periphery of the wafer comes into contact with the stage 7 and reduces the contact portion of the wafer which reinforces its wafer fixing force accordingly. At the same time, the amount of cooling gas used when cleaning the wafer can be reduced. Furthermore, the contact portion of the wafer is minimized and the wafer loading stage 7 is dent-shaped toward its central part. This construction makes it possible to help the cooling gas so that it may be deposited in a gap in the central part of the wafer and increase the pressure of the cooling gas and hence clean the whole wafer to a satisfactory extent.</p> |
