| 摘要 |
PURPOSE:To perform wire bonding with high reliability by a method wherein the wire bonding operation is executed to a part between the following: a conductive adhesive with which a lead has been coated and which has been solidified; and a semiconductor chip. CONSTITUTION:When a unit frame (f) is introduced into a drying furnace or a heating furnace, it is laid between a diode chip 3 and a cup part 1. A conductive adhesive B composed of, e.g. a gold paste and the conductive paste B with which the terminal part of the unit frame (f) has been coated and which is composed of the same gold paste are dried and solidified. Then, the diode chip 3 is conductively bonded to the cup 1. The solidified layer of the conductive adhesive B which is composed mainly of gold is formed at a terminal part 2. In addition, the diode chip 3 is wire-bonded to the terminal part 2 by using a gold wire 4 or the like. Thereby, their wire bonding operation can be executed with high reliability. |
