| 摘要 |
PURPOSE:To provide a method of automatically, easily mounting a circuit component provided with a lead on a printed wiring board without causing damage to an adjacent SIP component, where the lead of a component can be easily inserted into a through-hole provided on the printed board. CONSTITUTION:The lead 61 of an SIP component 6 is inserted into a corresponding through-hole 3, then air 8 is made to blow against the region of a printed wiring board 1 where a DIP component 5 is mounted from just above, then the DIP component 5 is held by a robot hand 10, and the lead 51 of the DIP component 5 is inserted into a corresponding through-hole 2. |
